Welcome to Seekchip.com    HOME
   Current position: Home > Shortcut to B > B33 Series > B3370V(LM337)


You can fill in the blank to send your urgent purchasing info,so that the suppliers will get to you soon. Note: * are required!
*  Part Number *  Quantity
*  Business Location *  Email

B3370V(LM337) More Information


• 24-Bit SPI for Control and Fault Reporting, 3.3 V/5.0 V Compatible • Outputs Are Current Limited (0.9 A to 2.5 A) to Drive Incandescent   Lamps • Output Voltage Clamp of +50 V During Inductive Switching • On/Off Control of Open Load Detect Current (LED Application) • VPWR Standby Current < 10 µA
 B3370V(LM337) PDF Download

B3370V(LM337) PDF

File Size:485706 KB


The B3370V(LM337) and B3370V(LM337) are 9,437,184-bit Syn- chronous Static Random Access Memory designed for high performance second level cache of Pentium and Power PC based System. It is organized as 256K(512K) words of 36(18) bits and inte- grates address and control registers, a 2-bit burst address counter and added some new functions for high perfor- mance cache RAM applications; GW, BW, LBO, ZZ. Write cycles are internally self-timed and synchronous. Full bus-width write is done by GW, and each byte write is performed by the combination of WEx and BW when GW is high. And with CS1 high, ADSP is blocked to control signals. Burst cycle can be initiated with either the address status processor(ADSP) or address status cache controller(ADSC) inputs. Subsequent burst addresses are generated inter- nally in the system¢s burst sequence and are controlled by the burst address advance(ADV) input. LBO pin is DC operated and determines burst sequence(lin- ear or interleaved). ZZ pin controls Power Down State and reduces Stand-by current regardless of CLK. The B3370V(LM337) and B3370V(LM337) are fabricated using SAMSUNG¢s high performance CMOS technology and is available in a 100pin TQFP and Multiple power and ground pins are utilized to minimize ground bounce.


NOTES (a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

Related Models

Parr number/PDF Mfg Pack D/C Descrpion Parr number/PDF Mfg Pack D/C Descrpion
 B332K NEC's NESG2021M05 is fabrica  B3329P-1K control and communications t
 B332K NEC's NESG2021M05 is fabrica  B330LA VISHAY DO-214AC 08+  metalized back and with
 B332K NEC's NESG2021M05 is fabrica  B331T SOT-23 SS (Pin 10): Soft Start. Conn

B3370V(LM337) Suppliers

Part Number Mfg Pack D/C Qty Description Inquiry
B330 06+ 06+ SOT23-5 2100 original
B330 23000
B330 05+ 05+ TSOT23-5 785 in stock
B330-12H 05+ 05+ ZIP40 60 new and original
B330-13 06+ 06+ 1,000 04 OEM STK
B330-13 07 07 DO-214AB 76500
B330-13 07 07 DO-214AB 79000
B330-13 2009+ 2009+ SMC(DO-214AB) 80000 NEW IN STOCK
B330-13-F 06+ 06+ 50000
B330-13-F 06+ 06+ SMC DIODES
Quick search: 0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z ALL
About Seekchip- Services - Comments - Contact us - Links - Map

© 2008 China Electronics Market,License 浙ICP备10014259号-9