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BFQ10 More Information

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D/C: N/A


Note 2: The typical junction-to-ambient thermal resistance of the molded plastic DIP (N) is 105˚C/W, the molded plastic SO (M) package is 155˚C/W, and the cerdip (J) package is 125˚C/W. All numbers apply for packages soldered directly into a printed circuit board.
 BFQ10 PDF Download


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This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.


The parameters governing address generation are loaded into five 24-bit configuration registers via the Processor Interface. These parameters include the Start Address, the beginning address of the sequence; the Block Size, the number of addresses in the address block; the Address Increment, the increment between addresses in a block; the Number of Blocks, the number of address blocks in a sequence (minimum 1); the Block Increment, the increment between starting addresses of each block. The loading and structure of these registers is detailed in the Processor Inter- face text.

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BFQ10 Suppliers

Part Number Mfg Pack D/C Qty Description Inquiry
BFQ10 04+ 04+ 1000
BFQ10 (advantage series (advantage series CAN6 450
BFQ10 03(specialty) 03(specialty) CAN6 1750
BFQ10 99+ 99+ CAN 1489
BFQ10 99+ 99+ CAN 895
BFQ10 99+ 99+ 5071
BFQ10 00+ 00+ CAN 2687
BFQ10 N/A 1000
BFQ10 CAN 4428
BFQ10 CAN 2660
BFQ10 CAN 2000
BFQ10 CAN6 1000
BFQ10 02+ 02+ CAN8 200 http://www.silicon-ic.com
BFQ10 1874
BFQ10 n/a n/a 66
BFQ10 2008 950
BFQ10 CAN6 300
BFQ10 N/A N/A N/A 2000
BFQ10 CAN 598 new in stock
BFQ10 500 500 N/A CAN
BFQ10 07/08+ 07/08+ CAN6 1030 new & original package and in our stock
BFQ10 CAN6 900 STRC Verified
BFQ10 06+ 06+ 1820 CAN6
BFQ10 01+ 01+ CAN 3125
BFQ10 06+ 06+ 2000
BFQ10 06+ 06+ 2660
BFQ10 06+ 06+ 4428
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